We’ve already seen an rtc module added internally…
But what about multiple INTERNAL modules ?. It seems we need some kind of 3d printed carrier and access to what onboard i/o is still free. I already have a blood oxygen and heartrate monitor, interested in temperature , humidity, air pressure etc and will certainly add the rtc as above. One thought was to buy headerless core boards and solder one of these in instead (bending and cropping top pins) yet would then render it impossible to change core modules…
