Two small assembly issues

First issue is I found a small plastic part loose inside the case when I was doing the assembly. It may have been on the mainboard but it was loose.

Second, the included thermal pad seems way too thick for the cm4 on the adaptor board. I haven’t installed it yet since I left the batteries at home (doh) but just placing it on the cm4 makes the back stand out 1/4 inch (6mm) or more. I know they will compress but that seems excessive.

Thanks for any help.

Pete B.

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That little black part looks like the ones that go on the gpio port. It’s similar to what you see on normal PI’s on the camera port.

It’s not important & I usually remove them on the normal PI’s as they just get dislodged at some point anyhow.

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Yea, they hold the flappy part of the camera port closed so the robots don’t break them during the build process. As for the pad, they’re squishy, just push the back on harder. It’s a single pad that has to work with all the processor versions.

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You can cut the pad up and cover *up the ram or Ethernet chips too imo

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Hope that was a typo, certainly don’t want to “kiil the ram” :slight_smile:

Pete B.

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Hah, def not the hope with thermal paste. Fixed :grimacing:

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The plastic is a pick and place pad for the pick and place machines so its easier to pick the component and place it on the board, you can get rid of it.

Most likely came from here:

better to remove it and throw it, so it doesnt jiggle inside the case.

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I had this happen to me on unboxing its nothing but a piece of plastic cover nothing to worry about.

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Want to say thanks for all the replies.

Good to know something important hadn’t fallen off.

Have another good one now but I will make a new post for that.

Pete B.

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Thank you for your post. I also had that where-did-that-break-off-from plastic piece!