Hello,
I share my cooling system, inspired by several posts.
I use a Uconsole Lite with CM5 lite and no NVME (I’m waiting my order from HG).
I use a 110mmx55mmx1mm copper plate, cut from a larger one (/!\ with cutting tools), assembled to the back plate with a thermal adhesive roll.
During assembling, it’s important to be careful about air bubbles. I removed them with a credit card.
I use a thermal pad Thermal Grizzly - Minus Pad Pro - 1,5mm. It’s expensive but has a great thermal conductivity. It’s a bit thick for the CPU (I don’t have 1mm thickness) but OK other chip. Some are double layered.
I ran some tests with a standard Debian Trixie (Thanks Rex) with s-tui configured with 4 sqrt runners and I added a Youtube video later.
After 16min in a room at 28,5°C, the max temperature was 62.2°C which is very correct without active cooling or M.2 cooler at the back. Of course, the body is warm but still usable.
I’ll add one or two copper coolers at the back.
Note : it was done without batteries inside but I don’t think it will changes a lot.
Some thoughts and ideas :
- It’s possible to do the same with a 2mm plane and a thinner thermal pad but not tested.
- I have a remaining TG phaseSheet PTM pad. I don’t know if it can be useful in my case. Any Idea?
- Does NVME add heat inside the UConsole? I guess yes but at the opposite side.
- Does adding holes (ex: extension port plate) can improve the heat removal?
- Does adding a slim 3D printed PETG/Nylon shim between can prevent from having the whole body warm? If yes, is it harmful to the cooling?
