I guess it depends on how good your heat transfer is? You’re making a shim sandwich:
CPU - thermal ransfer material (paste/pad) - shim - paste/pad - back of uConsole.
With this solution, it raises up the whole board to the level of the uConsole and that means it’s only ONE transfer through paste, not two.
That said, you could solder a shim directly to the back case of the uConsole and try it that way. That would evel allow you to get creative and spread out the heat before it tries to dissipate. Steal a heatpipe from a laptop
even though mine had a expected temperature, I’m not sure if I can fit this board because the termal pad I have is very thick and at least in my case dont have space to compress more the cm5 to the thermal pad. When closing it I can feel how it put preassure to the cm5
Maybe my pad is thicker or am I missing something?
yes but that’s my point, at least the version of uConsole (2025) I have works with cm5 and stock thermal pad, and the temperature is fine, so I dont understand why to use the board to lift the CM, previous versions came with a thinner termal pad? that’s my question
