I just received and installed the CM5 and the Waveshare CMX-ADAPTER, and in my instance the heat spreader on the 2712 makes good contact with the aluminum back panel so I just squeezed a little dab of Arctic MX-6 on there. I’m seeing 40° at idle and 50° when compiling at 100% CPU utilization. In general it runs about 10° hotter than the CM4 did with the stock thermal pad.
I’m totally fine with these CPU temps, but it would be nice if it didn’t heat up the entire case so much so I will probably try sticking a low profile m.2 heatsink to the back as others have done.
unfortunately I don’t know the total thikness. I just kept adding layers, until I was spot on. My target was to get rid of the thermal pad, and replace it with thermal paste. It is more efficient at transfering heat.
So there is just thermal paste between the final layer of copper and the module? Was wondering if paste is enough to prevent electrical conductivity since its my first time doing this.
Was thinking of putting a thin thermal pad between to prevent electric conductivity.
Also I have a rolling mill so I should be able to get a single copper piece in there with a few tries.
I don’t think there needs to be an electrical isolation between the chip and the frame. I was thinking of the way the cpu’s on motherboards have only paste to the heatsink, so I went with it.
60mmx60mm is $20USD on their store and should work for several applications. It may be overkill but possibly worth testing. It’s 0.25mm thickness as well, so may help alleviate and provide more margin for some of the back cover pressure mentioned in this thread vs the 0.5mm thermal pads being used.
Down the road if I make the upgrade and source a CM5, riser, and some of this PCM I’ll take some temps and post an update.
Did you ever do this? I’m just recently ordered a WiFi only Uconsole without the CM4module and am intending on using a CM5 with the riser and some PTM7950 when it gets here. Thickness is also 0.25 mm, just worried that after a few heat cycles and melting/solidifying again that the PTM7950 will start acting like a glue, I’ve not used it before so unsure just how sticky it is when solidified.
Thanks for the tips, while I’m waiting I’ve picked up CM5 IO board to have a play around with it and installed standard Raspberry OS 64 (Trixie) from the Raspberry Pi imager. Just ordered a cheap 256GB M.2 SSD to add to it so an M.2 add-on would be nice for the uconsole when it gets here.
Not sure whether it’s the angle of the device, but does the coax connector stand a little proud of the cover to the chip of the CM. I’m looking to buy a uConsole and CM5 and exploring the best way to mount the board whilst keeping the unit cool.
It’s work perfectly !
